24-layer ATE test PCB fabrication for semiconductor testing

24-layer ATE Test Board PCB Manufacturing

24-layer ATE test board PCB manufacturing uses high-end Shengyi S1000-2M substrate and a thick gold plating process, with a minimum via diameter of 0.4mm, meeting the needs for high-density, high-speed signal transmission and making it ideal for demanding semiconductor test environments.

Main Features of 24-layer ATE Test Board PCB Manufacturing

• Ultra-multilayer structure: Featuring 24 conductive layers, the board achieves complex circuit interconnections and efficient signal isolation through multilayer stacking, ensuring signal integrity and electromagnetic compatibility.
• Advanced HDI technology: Supports buried and blind via high-density interconnect techniques, improving wiring density and PCB reliability.
• High-end materials and thick gold process: Utilizes Shengyi S1000-2M substrate and thick gold surface treatment, providing excellent conductivity, wear resistance, and corrosion resistance for repeated long-term testing.
• High-precision manufacturing: Minimum via diameter is 0.4mm, suitable for fine-pitch, high-precision assembly, meeting the requirements of next-generation IC testing.
• Strong stability and reliability: Specifically designed for high-intensity, long-duration test environments, ensuring the accuracy of test data and long-term stable operation of the board.

Main Applications

• Used in semiconductor test systems such as IC automated test equipment (ATE), chip test handlers, probe cards, and test sockets.
• Suitable for high-demand test scenarios such as IC function testing, performance evaluation, and aging testing.
• Widely applied in semiconductor research and development, advanced packaging and test lines, and mass production quality control, where high frequency, high speed, high precision, and high reliability are required.