depth routing creates a stepstair or groove shaped for pcb

Its core principle lies in selectively removing only the surface layer of the PCB to a predetermined depth, rather than completely cutting through the entire board. This approach preserves the underlying substrate intact, creating grooves or holes of specific depth only in the required areas.

Key Features

1. The blind milling process enables precise control over milling depth, achieving complex structures such as local steps, shallow grooves, or half-holes on the board.
2. This technology enables the creation of recesses or countersinks on PCBs, significantly enhancing component mounting diversity and flexibility.
3. Blind milling typically relies on high-precision automated equipment to ensure consistent depth and sharp contours, meeting the intricate manufacturing demands of modern electronics.

Typical Applications

1. When embedding specific components like RF modules, LEDs, or metal shields within the board, blind milling creates localized shallow recesses.
2. It fabricates PCB structures with stepped configurations, such as pre-formed spaces for semi-insertion connectors or specialized card slots.
3. It produces localized countersunk holes or recessed areas, facilitating placement of specialized structural components or enhancing board-level assembly density.
4. Widely applied in high-end communication equipment, smart terminals, automotive electronics, and other electronic product fields demanding high structural complexity and space utilization.