14-layer 3-step semiconductor test board PCB manufacturing

14-layer, 3-step Semiconductor Test Board PCB Manufacturing

14-layer, 3-step semiconductor test board PCB manufacturing, with its high density, high precision, and high reliability, is widely used in various advanced semiconductor test equipment and serves as a key foundation for ensuring chip quality and performance.

Main Features of 14-layer, 3-step Semiconductor Test Board PCB Manufacturing

• Multilayer high-density interconnection: The 14-layer structure combined with 3-step HDI technology supports complex circuit layouts and multi-signal isolation, meeting the requirements for high-density and high-speed signal transmission.
• Precision manufacturing process: Utilizes high-end Shengyi S1000-2M material, with gold-plated surface, minimum hole diameter of 0.5mm, and minimum trace/space of 4/4mil, suitable for fine-pitch and high-precision testing needs.
• High reliability and signal integrity: Advanced buried/blind via technology and inter-layer connections significantly enhance signal integrity and anti-interference capability, ensuring accurate test data.
• Excellent materials and craftsmanship: High temperature and corrosion resistance, suitable for long-term and complex testing environments.
• Flexible design and customization: Supports various test interfaces and customized designs, making integration into different testing systems easier.

Introduction to 14-layer, 3-step Semiconductor Test Board

• 14 layers: Refers to 14 conductive layers inside the PCB, enabling complex circuit connections and signal isolation through multilayer stacking, suitable for high-density and high-speed signal requirements, and promoting signal integrity and electromagnetic compatibility.
• 3 steps: Usually refers to the “steps” in HDI (High Density Interconnect) technology—three laser drilling and three lamination processes, supporting finer buried/blind via structures for more flexible connections and higher density, suitable for high-speed/high-frequency applications.
• Semiconductor test board: Specially used for functions such as chip function testing and aging testing, requiring high reliability, high precision, and excellent signal transmission capability.

Main Applications

• Semiconductor test systems such as chip test handlers, ATE automatic test equipment, probe cards, and load boards.
• High-demand test scenarios like IC function testing, aging testing, and failure analysis.
• Suitable for semiconductor packaging and testing and research and development fields with requirements for high frequency, high speed, high precision, and high reliability.