PCB fabrication solutions for 5G mobile mainboard HDI

This type of HDI circuit board features excellent electrical performance and reliable mechanical strength, and is widely used in high-end consumer electronics such as smartphones.

Main Features of 5G Mobile Mainboard PCB Fabrication

• Utilizes 3-step HDI structure, supporting higher wiring density and more complex circuit designs, suitable for 5G high-speed signal transmission requirements.
• Uses Shengyi S1000-2M high-performance material, offering superior heat resistance and reliable dimensional stability.
• Employs laser drilling technology to achieve various hole structures such as micro-blind vias and buried vias, enhancing circuit connection reliability.
• Variety of surface treatment processes, including ENIG (Electroless Nickel Immersion Gold) and OSP (Organic Solderability Preservative), improving soldering performance and oxidation resistance.
• Supports ultra-thin board thickness and fine traces, meeting the trend of thinner and lighter smartphone designs.
• Excellent signal integrity and electromagnetic compatibility, ensuring stable 5G high-speed data transmission.
• Customizable size, layer count, surface treatment, and other parameters according to customer requirements, flexibly meeting design specifications for different brands and models of phones.

Main Applications

• 5G smartphone mainboards and core functional modules.
• Mainboard PCBs for various high-end smart devices, such as tablets and wearable devices.
• High-speed data communication modules and wireless RF modules.
• Core circuit boards for ultra-thin, high-performance consumer electronics.
• Other electronic products that require high-density wiring and high-speed signal transmission.