Phenolic paper-based copper clad laminate is a common substrate material for printed circuit boards (PCBs). It is made by using high-purity wood pulp paper as the base, which is impregnated with phenolic resin and then laminated and cured before being covered with a layer of electrolytic copper foil. Due to the use of phenolic resin and paper-based materials in its structure, this type of board is typically low in cost, has excellent mechanical properties and electrical insulation, and is suitable for the mass production of cost-sensitive electronic products.
Main Structure:
- Insulating Paper Base: Uses high-purity wood pulp paper, processed through multiple physical and chemical treatments to ensure the insulation and mechanical strength of the board.
- Phenolic Resin: The paper base is fully impregnated with phenolic resin to enhance heat resistance, moisture resistance, and overall stability.
- Copper Foil: The surface of the board is covered with electrolytic copper foil, making it convenient for subsequent etching and circuit pattern formation.
Main Features of Paper-based Laminate:
- Low cost, suitable for mass production, helps reduce product manufacturing costs.
- Good dimensional stability, low bending and warping, not easily deformed even after long-term use.
- Excellent machinability, easy for punching, drilling, and milling, suitable for automated production.
- Good electrical insulation, meeting the safety requirements of general electronic products.
- The surface is often treated with rosin to improve solderability and flatness, but due to limited heat resistance, it cannot be finished with hot air solder leveling (HASL).
- Lightweight material, convenient for transportation and assembly.
Main Applications of Paper-based Laminate:
- Widely used in the PCB manufacturing of televisions, tape recorders, audio equipment, game consoles, telephones, home appliances, and other consumer electronics.
- In recent years, also used in power supply boards and control circuits of oscilloscopes (CRT), office automation equipment (OA machines), and other electronic devices.
- Suitable for cost-sensitive, general-performance, and mild-environment electronic products.
Common Specifications:
- Base thickness: 0.8mm, 1.0mm, 1.2mm, 1.5mm
- Copper thickness: 18μm, 25μm
- Board size: 1020x1030mm