AI switch printed circuit board fabrication for AI servers

AI Switch Baseboard Printed Circuit Board Fabrication

AI Switch Baseboard Printed Circuit Board Fabrication is a core aspect of modern AI computing infrastructure. The AI switch baseboard—also known as AI interconnect or switched baseboard—is specifically designed for artificial intelligence servers and high-performance computing (HPC) clusters. Serving as a vital high-speed data interconnect platform, it links multiple AI accelerator cards and the host CPU, enabling high-bandwidth, low-latency data exchange.

Brief Definition of AI Switch Baseboard

The AI switch baseboard integrates high-speed switch chips, such as PCIe Switch and NVSwitch, along with various high-speed interconnect channels. It supports efficient data transfer between AI accelerator cards like GPUs, OAM modules, and FPGAs, as well as between these accelerators and the host CPU. It is an essential component for large-scale AI computing platforms.

Main Functions

• High-speed data exchange: Integrates advanced switch chips for efficient communication between AI accelerators and CPUs.
• Multi-protocol compatibility: Supports various high-speed interconnect protocols such as PCIe, NVLink, and CXL.
• Unified power and management: Provides unified power distribution, monitoring, and management interfaces for all AI accelerator modules.
• Strong scalability: Compatible with various types of AI accelerator modules, supporting modular expansion and flexible system deployment.

Key Features of AI Switch Baseboard PCB Fabrication

• Ultra-high layer count and large size: Designs feature ≥20 layers, board thickness ≥3mm, meeting high-density interconnect demands.
• Precision manufacturing: Advanced PCB techniques such as minimum drill size 0.2mm, aspect ratio ≥15:1, dual-side back drilling, Skip Via, and POFV are employed.
• High-performance materials: Utilizes Very Low Loss and above-grade high-speed materials, high-speed ink, and Low Profile brown oxide technology to ensure signal integrity.
• High wiring density and impedance control: Line width/spacing down to 0.09/0.09mm, with impedance control accuracy up to ±8%.
• High bandwidth and low latency: Supports large-scale parallel high-speed signal transmission for demanding AI cluster performance.
• High reliability and maintainability: Features robust power distribution, thermal management, and supports hot-swappable modules for stable system operation.

Main Applications

• AI servers, such as the NVIDIA HGX platform, AI accelerator chassis, and supercomputing centers for high-density AI clusters.
• Large model training, AI inference, scientific computing, and cloud computing platforms.
• Data centers, supercomputing centers, and large-scale AI cloud computing infrastructure.