advanced server PCB manufacturing and design solutions

Server PCB manufacturing imposes high demands on processes and materials. Conventional electroplating equipment can no longer meet the process and production efficiency requirements. therefore, pulse VCP electroplating technology is used. In addition, the PCBs are made with high-speed materials, and plasma is employed to remove drilling debris after drilling to ensure the quality of the hole walls. There are extremely high requirements for linewidth and spacing control accuracy, so LDI exposure machines and vacuum etching lines are typically used for high-precision pattern transfer, ensuring strict impedance control. The maximum monitoring frequency for insertion loss can reach up to 16GHz, and as requirements for signal insertion loss continue to increase, high-speed ink and Low Profile browning processes are increasingly used to further optimize insertion loss control.

Main Features of Server PCB Manufacturing

• Supports 14 or more high-layer structures to meet the needs of complex server circuit designs.
• High aspect ratio and minimum 0.2mm hole diameter, suitable for high-density interconnections.
• Backdrill D+8mil design effectively reduces signal interference and loss.
• Uses pulse VCP electroplating to improve plating quality and production efficiency.
• High-speed materials and plasma drilling debris removal ensure the reliability of high-speed signal transmission.
• Precise linewidth/spacing control, combined with LDI exposure and vacuum etching, ensures impedance consistency.
• Maximum insertion loss monitoring frequency up to 16GHz, supporting high-speed data transmission requirements.
• Application of high-speed ink and Low Profile browning technology achieves better insertion loss control performance.
• Customizable multilayer structure, dimensions, and special features according to customer needs.

Main Applications

• Various high-performance server motherboards and expansion cards.
• Core processing modules for data centers and cloud computing platforms.
• High-speed switches, routers, and other network communication devices.
• High-performance storage systems and RAID controller boards.
• Industry-specific servers for finance, energy, healthcare, and other sectors with high data processing demands.
• Other electronic devices requiring high reliability, high speed, and high-density interconnections.