26-layer PCB for high-speed networking and data centers

A 26-layer PCB is commonly used in high-end equipment that requires exceptional signal integrity, anti-interference capability, and routing space. Its multilayer structure helps optimize power distribution, enables precise impedance control, and supports advanced technologies such as blind/buried vias and HDI, meeting the demands of high-speed, high-frequency, and multi-chip integration applications.

Main Features of a 26-Layer Printed Circuit Board

• Ultra-high layer count design supports complex and high-speed signal routing.
• Uses Tachyon 100G and hydrocarbon materials for extremely low signal loss, making it ideal for high-speed data transmission.
• Fine line width/spacing and small via technology increase routing density.
• Uniform board thickness and stable structure suit large-scale networking equipment.
• Even copper thickness on inner and outer layers, with strong current-carrying capacity and excellent oxidation resistance.
• ENIG (Electroless Nickel Immersion Gold) surface finish effectively prevents oxidation and ensures reliable soldering.

Primary Applications of 26-Layer PCBs

• High-end network switches.
• Core switching devices for data centers.
• High-speed routers and optical communication systems.
• Large enterprise and telecom operator network infrastructure.

Key Parameters

• Layers: 26
• Materials: Tachyon 100G, hydrocarbon
• Board thickness: 3.5±0.35mm
• Inner/outer copper thickness: 0.33OZ
• Minimum line width/spacing: 0.118/0.051mm
• Minimum hole diameter: 0.225mm
• Surface finish: ENIG