24-layer high-density aerospace PCB manufacturing

24-layer high-density aerospace PCB manufacturing services

24-layer high-density aerospace PCB manufacturing uses high-performance TUC TU872SLK material combined with advanced processes such as ENIG surface finish, providing a high number of layers and wiring density.

Description

24-layer high-density aerospace PCB manufacturing meets the stringent requirements of miniaturization, lightweight, and high reliability in the aerospace field.

Main Features of 24-Layer High-Density Aerospace PCB Manufacturing

  • High-layer design supports complex and high-density circuit integration.
  • Uses premium TUC TU872SLK substrate with excellent dielectric properties, high temperature resistance, and corrosion resistance.
  • ENIG (Electroless Nickel Immersion Gold) surface finish ensures good solderability and strong oxidation resistance.
  • Excellent signal integrity, suitable for high-speed and high-frequency signal transmission needs.
  • High mechanical strength with strong vibration and impact resistance, adaptable to harsh environments.
  • Supports customized designs to meet diverse aerospace electronic equipment requirements.

Main Applications

  • Aerospace navigation and control systems.
  • Avionics instruments and flight control systems.
  • Satellite communication and data processing equipment.
  • Aviation radar and sensor systems.
  • Space measurement, control, and remote sensing equipment.
  • Other high-reliability aerospace electronic fields.