24-layer 2nd-order HDI PCB for high density applications

A Twenty-Four Layer Printed Circuit Board (PCB)

A twenty-four layer printed circuit board (PCB) is a high-end multilayer PCB, typically used in electronic systems that require complex circuitry, high-density routing, high-speed signal transmission, and high reliability.

Main Features of 24-Layer PCBs

• Supports ultra-high-density and complex circuit routing.
• Utilizes 2nd-order HDI technology with stacked and staggered blind/buried vias.
• Excellent signal integrity and EMI/EMC performance.
• Precise impedance control and optimized power distribution network.
• Suitable for high-speed, high-frequency, and multi-chip integration designs.
• Meets the requirements for large-scale component mounting with high reliability.
• Multiple layers provide ample routing space for extremely complex circuit designs and ultra-dense component layouts.
• Superior electrical performance: multilayer structure helps enhance signal and power integrity, reducing crosstalk and noise.
• Strong EMI/EMC control: facilitates electromagnetic compatibility design, ideal for high-speed, high-frequency applications.
• Supports advanced processes such as blind/buried vias and HDI, enabling smaller size and higher integration.

Main Applications of 24-Layer PCBs

• High-performance servers and data center equipment.
• Network communication and base station equipment.
• Aerospace electronic systems.
• Medical instruments and industrial automation.
• High-end computing and communication terminals.

Main Specifications

• Number of Layers: 24
• Material: FR-4 (Tg180), VT-47
• Board Thickness: 2.59±0.26mm
• Trace Width/Spacing: 3.5/5.0mil
• Hole Diameter: 0.25mm
• Surface Finish: ENIG (Immersion Gold)