Our PCB manufacturing uses HDI, gold plating, buried vias, Back drilling and advanced processes for compact designs, high reliability, and top performance.

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back drilling

back drilling for removing excess copper pillars from PCB vias

blind vias

blind vias connect the surface layer and inner layers

buried vias

buried vias are used to connect internal layers of a PCB

carbon ink PCB

carbon ink PCB for cost-effective keypads and contacts

castellated holes and edges on a PCB

castellated holes and edges on a PCB for WiFi modules

depth routing

depth routing creates a stepstair or groove shaped for pcb

ENIG PCB

ENIG PCB uses electroless nickel immersion gold technology

gold finger PCB

gold finger PCB with durable edge connectors for connections

high density interconnect PCB

high density interconnect PCB for mobile and IoT devices

hybrid PCB

hybrid PCB means that mixed laminate print circuit board

IC substrate

IC substrate for connecting chips to circuit boards

immersion silver PCB

immersion silver PCB for high conductivity and solderability

immersion tin PCB

immersion tin PCB for solderability and oxidation protection

jump v-scoring

jump v-scoring with selective PCB v-groove technique

lead-free hot air solder leveling

lead-free hot air solder leveling for PCB surface protection

nickel-plated carbon film PCB

nickel-plated carbon film PCB for conductive contacts

OSP PCB

OSP PCB with organic solderability preservative surface

PCB offers multiple solder mask colors

PCB offers multiple solder mask colors to choose from

resin-filled via PCB

resin-filled via PCB for enhanced reliability and soldering

silver paste filled via PCB

silver paste filled via PCB for conductivity applications