AAU module printed circuit board fabrication

AAU module printed circuit board fabrication for wireless

The fabrication of AAU module printed circuit boards usually employs high-speed, high-frequency materials, with high requirements for heat dissipation and soldering reliability.

Description

AAU (Active Antenna Unit) Module Printed Circuit Board Fabrication

The AAU, Active Antenna Unit, is a key component in mobile communication base stations for wireless signal transmission and reception, integrating multiple functions such as RF, signal processing, and antennas. AAUs feature high integration, high reliability, high transmission rates, and excellent heat dissipation. AAU module printed circuit boards typically have 14 or more layers, with fine-line designs on both inner and outer layers, and widely use advanced technologies such as POFV (plated over filled via), back drilling, and embedded copper blocks. The outer layer includes RF circuit designs, enabling not only high-speed signal transmission but also partial RF transceiver functions.

Main Features of AAU Module Printed Circuit Board Fabrication

  • Uses high-speed, high-frequency materials to ensure stable high-speed signal transmission with low loss characteristics.
  • High layer count design (≥14 layers) supports complex circuit integration and functional module partitioning.
  • Fine-line designs on both inner and outer layers improve signal integrity and meet high-density routing requirements.
  • Supports advanced processes such as POFV, back drilling, and embedded copper blocks, effectively enhancing heat dissipation and electrical performance.
  • RF circuit design on the outer layer meets both high-speed and RF signal transceiving needs.
  • Excellent thermal management performance to meet the heat dissipation requirements of high-power devices.
  • High soldering reliability to accommodate complex processes and mass production needs.
  • Customizable dimensions, structures, and special functions according to customer requirements, flexibly adapting to various application scenarios.

Main Applications

  • 5G and 4G mobile communication base station AAU active antenna units.
  • RF front-end modules and signal processing modules for wireless communication systems.
  • High-speed data transmission and switching equipment.
  • Smart antenna systems and MIMO communication systems.
  • Other wireless communication devices with stringent requirements for high-speed signal transmission and high integration.