5G signal test PCB fabrication with RO4350B+TU768 process

5G signal test printed circuit boards can achieve a minimum hole diameter of 0.2mm and line width/spacing of up to 100μm, effectively meeting the strict requirements for high precision and high reliability in 5G signal testing. These circuit boards are widely used in high-end electronic testing fields such as 5G signal testing.

Main Features of 5G Signal Test PCB fabrication

• Uses RO4350B+TU768 high-performance substrates to ensure excellent high-frequency characteristics and signal transmission quality.
• Hybrid pressing process enhances the overall performance of the board, suitable for multilayer and complex structure designs.
• Mechanical drilling technology enables high-precision holes as small as 0.2mm, meeting the needs of high-density assembly.
• Surface treatment uses ENIG (Electroless Nickel Immersion Gold) process, improving soldering reliability and oxidation resistance, and extending product lifespan.
• Line width and spacing as fine as 100μm support high-precision circuit designs, ensuring the integrity of 5G high-frequency signals.
• Excellent dimensional stability and mechanical strength ensure the stable operation of the board in various testing environments.
• Customizable number of layers, size, and related parameters according to customer requirements, meeting diversified testing applications.

Main Applications

• Main control boards and related functional modules for 5G signal testing equipment.
• High-frequency, high-speed signal testing instruments and systems.
• Various wireless communication testing platforms and antenna testing modules.
• Test and verification circuit boards for communication base stations and network terminals.
• Other electronic testing fields with strict requirements for high frequency, high precision, and high reliability.