switch PCB manufacturing

switch PCB manufacturing for high-density networking

Switch PCBs are usually designed with multilayer structures of 12 or more layers and aspect ratios above 9:1 to meet the needs of high-density assembly and complex signal transmission.

Description

The line width and spacing reach 0.075 and 0.090mm, and the hole diameter is 0.225mm, making them suitable for high-density interconnection. Switch PCB manufacturing commonly adopts hybrid pressing processes, mainly using Ultra Low Loss grade high-speed materials mixed with standard FR4 materials to balance signal performance and cost control. The PCB layout usually includes a large number of optical module or high-speed connector interfaces. To meet the requirements of insertion loss and signal integrity for high-frequency and high-speed signals, advanced technologies such as back drilling and resin plug holes + POFV are widely used in the design.

Main Features of Switch PCB Manufacturing

  • Multilayer structure, generally with 12 layers or more, suitable for complex network device designs.
  • High aspect ratio, greater than or equal to 9:1, supporting high-density vertical interconnection.
  • Fine circuit craftsmanship, with minimum line width/spacing of 0.075/0.090mm, meeting high-speed signal transmission requirements.
  • Minimum hole diameter of 0.225mm, suitable for high-density interconnection and miniaturized designs.
  • Hybrid pressing process, combining Ultra Low Loss high-speed materials with standard FR4 for balanced performance and cost.
  • Numerous high-speed interface layouts to accommodate multiple optical modules and high-speed connector applications.
  • Supports back drilling and resin plug holes + POFV processes, significantly reducing signal insertion loss and improving signal integrity.
  • Customizable dimensions, layer count, special processes, and interface layouts according to customer requirements.

Main Applications

  • Various high-performance network switch motherboards and expansion cards.
  • Core switching equipment for data centers and cloud computing platforms.
  • High-speed routers and backbone network communication equipment.
  • Core switching equipment for large enterprise networks and metropolitan area networks.
  • High-speed interconnection modules in 5G communication base stations and transmission networks.
  • Other network and communication equipment fields with stringent requirements for high-speed signals and high-density interconnection.