5G RF high-frequency PCB circuit board manufacturing

The 5G RF PCB board features hole diameters as small as 0.2mm and line width/spacing down to 100/100μm, meeting the stringent requirements of high-frequency, high-speed signal transmission. It is widely used in 5G signal testing and related fields.

Main Features of 5G RF PCB Board Manufacturing

• Uses high-performance RO4350B + TU768 materials with excellent high-frequency characteristics and low dielectric loss, ensuring stable signal transmission.
• Advanced hybrid pressing process effectively enhances interlayer bonding strength and extends product lifespan.
• Precision mechanical drilling achieves minimum hole diameters of 0.2mm, suitable for high-density assembly and micro-component soldering.
• The surface uses an ENIG (Electroless Nickel Immersion Gold) process, providing excellent solderability, improved oxidation resistance, and adaptability to complex conditions.
• Minimum line width/spacing down to 100/100μm, supporting high-speed, high-density routing designs.
• Good manufacturing consistency and high reliability, suitable for mass production and complex testing requirements.
• Customizable layers, thicknesses, and special functions according to customer needs, flexibly meeting various application scenarios.

Main Applications

• 5G signal testing equipment and RF testing systems.
• 5G base station RF modules and antenna units.
• High-speed signal transmission and microwave communication devices.
• Wireless communication terminals and RF front-end modules.
• Radar, satellite communication, and other high-frequency electronic fields.
• Other communication and electronic devices with stringent requirements for high frequency and high reliability.