high-speed PCB

high-speed PCB solution for ultra-fast data transmission

High-speed boards are specially designed for scenarios requiring high speed, large bandwidth, and high reliability, and are widely used in data communication, cloud computing, servers, and high-end electronic equipment fields.

Description

High-Speed Board (High-Speed PCB, High-Speed Board)

High-Speed Board (High-Speed PCB, High-Speed Board) refers to a printed circuit board (PCB) specially designed and manufactured for high-speed signal transmission. High-speed boards are optimized in terms of structure, materials, and processes to ensure signal integrity, electromagnetic compatibility, and reliability in high-frequency, large-bandwidth, and high-speed data transmission environments.

Main Features

  • High Layer Count Design: Utilizes an 18-layer high-density interconnect structure, supporting complex high-speed signal transmission and multifunctional integration to meet advanced electronic system design needs.
  • Ultra-High Aspect Ratio Capability: With a finished board thickness of 4.0mm, minimum hole diameter of 0.20mm, and an aspect ratio up to 20:1, it is suitable for applications requiring high reliability and high current load.
  • Premium Substrate: Uses Panasonic M6 high-performance material, featuring low loss and excellent dielectric properties to ensure stable high-speed signal transmission.
  • Precise Impedance Control: High accuracy in characteristic impedance control, ±7.5% for ≤50Ω and ±5% for &gt.50Ω, ensuring high-speed signal integrity and compatibility with various high-speed interfaces.
  • Advanced Backdrill Technology: Employs dual-sided backdrilling, with stub length less than 0.08mm, effectively reducing signal crosstalk and reflection and improving signal integrity.
  • Resin Plugged Via Technology: Uses resin plugged via process to enhance insulation and mechanical strength within vias, suitable for high-density routing and BGA packaging designs.
  • Ultra-High-Speed Transmission Capability: Supports data transmission rates up to 64Gbps, meeting future needs for high-speed interconnection and large bandwidth.

Main Applications

  • 5G base stations and high-speed communication equipment.
  • Data center high-speed switches and routers.
  • Server motherboards and high-performance storage devices.
  • High-speed signal processing and test instruments.
  • High-end network devices and electronic systems with strict requirements for high speed and high reliability.