high-frequency 5G active antenna printed circuit board

Main Features

• Rich Layer Structure: Utilizes a 22-layer (22L) high-density interconnect structure to support complex RF signal transmission, meeting the stringent requirements for signal integrity and isolation in high-frequency 5G applications.
• High-Performance Materials: Uses Doosan DS-7409DV HVLP high-frequency, low-loss materials to ensure excellent dielectric properties and low insertion loss in high-frequency applications.
• Multiple Lamination Process: Employs a two-step lamination process to significantly enhance interlayer bonding strength and final product reliability, making it suitable for the complex processes required by multilayer boards.
• Complex Backdrill Design: Features 11 backdrill strips to optimize signal routing, reduce parasitic effects and signal interference, and improve high-speed signal integrity.
• VIPPO Technology: Incorporates VIPPO (Via In Pad Plated Over) technology for higher wiring density and superior electrical performance, supporting miniaturization and high integration trends.
• Embedded Copper Blocks: Integrates 22 copper blocks within the board to enhance local heat dissipation and improve thermal management for high-power active components.
• Multiple Impedance Control: Supports 10 different impedance designs for both single-ended and differential signal transmission, meeting diverse RF device impedance matching needs.
• Advanced Via Filling Technology: Utilizes high- and low-pressure electroplated via filling techniques to improve the quality of metal filling in vias, achieving greater electrical and mechanical reliability.

Main Applications

• 5G base station active antennas (AAU/AAU Massive MIMO).
• High-frequency RF modules and transceivers.
• High-density antenna arrays in wireless communication systems.
• High-power RF front-end modules.
• High-end communication equipment requiring high-frequency, low-loss, and superior heat dissipation performance.