flame retardant copper clad phenolic paper laminate PCB

The material of flame retardant copper clad phenolic paper laminate complies with the UL 94 V-0 flame retardant standard, featuring excellent flame resistance and electrical insulation properties.

Main Structure:

1. Insulating Paper Base: Made from high-purity wood pulp paper, treated multiple times to ensure electrical insulation and mechanical strength.
2. Phenolic Resin: The paper base is impregnated with phenolic resin to enhance heat resistance, moisture resistance, and board stability.
3. Copper Foil: High-purity electrolytic copper foil is laminated on the surface to facilitate subsequent etching and circuit pattern formation.

Main Features of Flame Retardant Copper Clad Laminat:

1. Low cost, suitable for mass production.
2. Excellent flame retardancy, meets the 94 V-0 standard.
3. Good moisture and heat resistance.
4. Good dimensional stability, low warpage and distortion, superior mechanical processing performance.
5. Suitable punching temperature is 40°C to 70°C, easy for punching, drilling, and other processing.
6. Rosin treatment is commonly used on the surface. due to temperature resistance, it cannot undergo solder coating treatment.

Main Applications of Flame Retardant Laminate:

1. Widely used in the manufacturing of circuit boards for consumer electronics such as televisions, tape recorders, audio equipment, game consoles, telephones, and household appliances.
2. In recent years, it is also used in power supply boards of oscilloscopes (CRT) and office automation equipment (OA equipment).
3. Suitable for cost-sensitive and mild working environment electronic products.

Common Specifications:

1. Base thickness: 1.2mm, 1.6mm
2. Copper thickness: 25μm, 35μm
3. Board size: 1020 x 1030mm