immersion tin PCB

immersion tin PCB for solderability and oxidation protection

Chemically tinned boards are PCBs coated with a layer of tin deposited chemically. Their primary functions are oxidation prevention and enhanced solderability, making them a common eco-friendly surface treatment method.

Description

Electroless Tin Plating for PCBs

Electroless tin plating, fully known as chemical tin plating (commonly referred to as Electroless Tin PCB or Immersion Tin PCB), is a widely used surface treatment process for printed circuit boards (PCBs).

Its primary purpose is to deposit a uniform layer of pure tin (Sn) onto the copper surface of the PCB through a chemical reaction. This protects the copper layer from oxidation and enhances solderability.

Key Features

  • Excellent Solderability: The smooth, flat surface of the electroless tin layer is ideal for SMT and fine-pitch component soldering.
  • Environmentally Friendly &amp. Lead-Free: Complies with RoHS environmental standards, free of lead and harmful heavy metal residues.
  • Oxidation Prevention: The tin layer effectively isolates copper from air, preventing oxidation.
  • Simple Process &amp. Low Cost: Offers lower costs compared to high-end treatments like electrolytic gold immersion (ENIG).

Application Areas

Primarily used in general consumer electronics, standard communication boards, home appliance control boards, and other applications where extreme reliability is not required.