ENIG PCB uses electroless nickel immersion gold technology

Chemical Nickel Gold Plated Boards Overview

Chemical Nickel Gold Plated Boards represent a surface treatment process commonly employed for printed circuit boards (PCBs) in high-end electronic products. The process involves chemically plating a layer of nickel (Ni) onto the copper surface of the PCB, followed by depositing a thin layer of gold (Au) onto the nickel layer.

Key Features of ENIG PCB

• Excellent Solderability: Features a smooth, flat surface suitable for fine-pitch component soldering.
• Strong Oxidation Resistance: The gold layer protects underlying nickel and copper from oxidation and corrosion.
• Superior Electrical Performance: Suitable for high-speed, high-frequency signal transmission.
• High Durability: Ideal for interfaces requiring frequent insertion/removal, such as gold fingers.

Application Areas of Electroless Nickel Immersion Gold Printed Circuit Board

• High-end computer motherboards and servers.
• Communication equipment.
• High-reliability electronics like storage devices and graphics cards.
• Gold fingers, BGAs, connectors, and similar components.