10-layer printed circuit board

10-layer printed circuit board for 400G optical module

A ten-layer printed circuit board (10-layer PCB) is a type of multilayer PCB made by alternately laminating ten layers of conductive copper foil and insulating materials. 10-layer PCBs can effectively improve signal integrity and electromagnetic compatibility (EMC), reducing crosstalk and noise interference.

Description

Ten-layer Printed Circuit Board Overview

Ten-layer printed circuit boards typically include multiple sets of signal layers, power layers, and ground layers. Through a well-designed stack-up structure, they provide more routing space and superior electrical performance for complex, high-speed, and high-density circuit designs.

Main Features of Ten-layer Printed Circuit Boards

  • Supports 400Gbps ultra-high-speed signal transmission to meet the needs of next-generation data centers and high-speed networks.
  • Utilizes a 10-layer high-density stack to enhance signal integrity and power distribution.
  • Uses high-performance M6 (R-5775) materials to ensure reliability and low loss in high-frequency environments.
  • High precision in thickness at the gold finger area and plug profile ensures stable module insertion and connection.
  • Surface treatment combines ENEPIG (Electroless Nickel Palladium Gold) and hard gold plating, offering excellent contact and abrasion resistance.
  • Unique embedded copper block thermal design effectively improves heat management for high-power working conditions.

Main Applications of Ten-layer Circuit Boards

  • Suitable for 400G optical modules and QSFP-DD standard high-speed interconnect products.
  • Widely used in data centers, high-speed network switches, routers, and similar fields.
  • Applied in telecommunication infrastructure and next-generation optical transmission systems.
  • Ideal for industrial and communication electronic equipment that requires high frequency, high speed, and high reliability.

Specifications

  • Number of layers: 10
  • Product model: 400Gbps QSFP-DD
  • Material: M6, R-5775
  • Finished thickness tolerance (gold finger area): 1.0±0.075mm
  • Plug profile tolerance: ±0.05mm
  • Via depression: less than 15μm
  • Surface treatment: ENEPIG + hard gold plating
  • Thermal design: embedded copper block